China Resin Bond Diamond Blades For Cutting Chip

Resin Bond Diamond  BladesProducts DescriptionResin bond diamond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.Application Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiberAdvantages 1. High-Precision, large depth and narrow kerf 2. Smooth& fast cutting without chipping3. Long life span and stable performance4. Competitive price and superior quality5. Safe package and fast delivery6. Professional & excellent serviceItemSpecificationOD50-125mmID25.4/40/88.9Grit200#-5000# (D107-D1)Thickness0.10-2.00mm (Based    on diamond grit size)According to customers’ requirement             Email: [email protected] Bond Agent:※Resin bond & metal  bond & electroplated