High Performance Metal Bond Ultra Thin Diamond Cutting Circular Blade For Sapphire And Monocrystalline Silicon

Metal Bond Diamond BladesProducts DescriptionMetal bond diamond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain. With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.Application Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiberAdvantages 1. High-Precision,large depth and narrow kerf 2. Smooth&fast cutting without chipping3. Long life span and stable performance4. Competitive price and superior quality5. Safe package and fast delivery6. Professional & excellent serviceItemSpecificationOD50-125mmID25.4/40/88.9Grit200#-5000# (D107-D1)Thickness0.10-2.00mm (Based    on diamond grit size)According to customers’ requirement             Email: [email protected] Bond Agent:※Resin bond & metal  bond & electroplated